This paper explores the application of advanced packaging technology in promoting the miniaturization of camera modules, focusing on technologies such as stacked packaging, system-in-package (SiP), and chip-scale packaging (CSP). The paper first outlines the basic principles and key characteristics of these packaging technologies, and then discusses in detail their specific applications in improving the integration and optimizing the performance of camera modules. Through the study of multiple cases, the paper demonstrates how these advanced technologies overcome challenges such as space constraints, thermal management, and signal integrity in miniaturization, revealing their advantages in enhancing the performance and reliability of camera modules. The study emphasizes the crucial role of advanced packaging technology in promoting the miniaturization of camera modules and related technological development, providing guidance for future technological trends.

Liujun Wu, Pengfei Gou, Song Ai, Chaoneng Yang, Hangyu Wan, Xiaocheng Fang. Advanced Packaging Technology in Miniaturization of Camera Modules. International Journal of Social Sciences and Economic Management (2024), Vol. 5, Issue 1: 58-64. https://doi.org/10.38007/IJSSEM.2024.050108.

[1] Chen Jialan. The signal of industry recovery has appeared as the shipment and price of mobile phone lenses rise?. China Business Report, 2023-10-23 (C01);

[2] Zhang Mingshuang. Hongjing Optoelectronics plans to conduct two capital increases before applying for listing on the GEM. Daily Economic News, 2023-10-20 (004);

[3] Zhang Kouwen, Development of driver monitoring camera modules with infrared perception function. Zhejiang Province, Zhejiang Shunyu Zhiling Technology Co., Ltd., 2023-05-17;

[4] Wang Jianming, Large lens drive VCM motor suitable for 4K HD camera modules. Zhejiang Province, Hangzhou RiYue GuangDian Technology Co., Ltd., 2021-11-21.