With the development of the semiconductor industry and optical engineering, the demand for ultra-smooth surfaces of silicon-containing materials is increasing, and the requirements for surface quality are particularly stringent. Because many silicon-containing materials are difficult to process, and the surface requirements are complex, it poses a challenge to the existing traditional processing methods. The widely used machining method is mainly contact processing. On the one hand, it will damage the surface lattice of the material, leaving residual stress and sub-surface damage. On the other hand, the equipment requirements are very high. It is still difficult to achieve the polishing of aspherical components. Balance between requirements, accuracy requirements and economy. Therefore, atmospheric plasma processing technology has been introduced into the field of vision as a new processing method with good prospects. 

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