International Journal of Social Sciences and Economic Management, 2026, 7(2); doi: 10.3807/IJSSEM.2026.070206.
Wenhao Song
Information Networking Institute, Carnegie Mellon University, Pittsburgh, Pennsylvania, United States, 15213
Memory leaks in Android applications generally occur because objects are still strongly referenced by GC roots after a component has been destroyed, leading to continuous growth of heap memory, frequent garbage collection, UI freezing, and eventually memory overflow. Given the shortcomings of the previous method, such as lacking lifecycle semantics, limited dynamic evidence coverage, and no risk constraints on remediation strategies, this paper proposes a lifecycle-reference chain collaborative LC-Hybrid method: record component states as event sequences, calculate retention paths with a heap reference graph, identify asymmetric releases of listeners, tasks, contexts, and heavy resources using static rules, and finally form tiered remediation recommendations through evidence fusion scoring. Based on the previous three years' public research and benchmark data, a supporting secondary statistics table has been prepared. According to the results from DroidLeaks, InferROI is a large-scale model intent inference and static analysis tool with a defect detection rate of 59.3% and an F1 score of 0.667; after fixing the problems, the total heap memory in the LeakPair public project decreased from 830.3 MB to 734.0 MB, and the project-level pairing showed significant improvement in the Wilcoxon test. Based on the above, this paper proposes an all-encompassing optimisation process of discovery, localisation and remediation, followed by regression validation, and clarifies its scope.
Android; memory leak; lifecycle; heap reference graph; dynamic analysis; program repair
Wenhao Song, Research on Memory Leakage Detection and Optimization Methods for Android Applications. International Journal of Social Sciences and Economic Management (2026), Vol. 7, Issue 2: 58-66. https://doi.doi.org/10.3807/IJSSEM.2026.070206.
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